Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC™ brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The Wi-Fi 6/6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications like gaming consoles, AR/VR, smart speakers, media-streaming devices and automotive Infotainment. Applications that require an instant response – like security systems and industrial automation – will also benefit from Infineon’s new products.

ON Semiconductor RSL10 SIP:通过蓝牙 5 认证的系统级封装
Published in Bluetooth chips

RSL10 SIP 是将业界最低功耗的蓝牙低功耗技术用于无线应用的最简便方案。

RSL10 SIP 通过了蓝牙 5 认证,完全符合全球无线标准,采用了无需任何额外天线的设计,可显著缩短产品上市时间。

即用型 RSL10 SIP 将集成式天线、RSL10 无线电 SoC 和所有无源组件整合在一个微型封装内。

The BlueNRG-LP is an ultra-low power programmable Bluetooth® Low Energy wireless SoC solution. It embeds STMicroelectronics’s state-of-art 2.4 GHz RF radio IPs combining unparalleled performance with extremely long-battery lifetime. It is compliant with Bluetooth® Low Energy SIG core specification version 5.2 addressing point-to-point connectivity and Bluetooth Mesh networking and allows large-scale device networks to be established in a reliable way. The BlueNRG-LP is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency applications.
Renesas:IoT Sensor Board with Machine Learning & Bluetooth® Low Energy
Published in Bluetooth modules
This is a reference design for a versatile Internet of Things (IoT) sensor board solution. It targets applications in industrial predictive maintenance, smart home/IoT appliances with gesture recognition, wearables (activity tracking), and mobile for innovative human machine interface, or HMI, (FingerSense) solutions. This reference design was developed with Renesas partner Qeexo, who provided their Automated Machine Learning platform (AutoML) for edge devices.
Connectivity overview
 Expanded portfolio of wireless connectivity devices across scalable memory and performance options.
Arm® Cortex® architecture
32kB to 352KB flash memory
20kB to 80kB SRAM with pin-to-pin compatibility
Across wireless connectivity protocols
Supporting a broad range of Bluetooth® Coded PHY, 2MB PHY, Extended advertising, Bluetooth Low Energy 5.1,Locationing, Mesh, Multiprotocol
Quarterly SDK releases with latest Bluetooth Low Energy features
Scalable Scalablefeatures
Integrated sensor controller, precision ADC, PA, coexistence BAW resonator
• Power output: +5dBm
• -97dBm sensitivity
• Sofware configurable